Ultrasonic energy for adhesive bonding

Details Ultrasonic energy for adhesive bonding Ultrasonic energy for adhesive bonding

2007-12-20

2010-11-30

Sells, James (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S330000

Reexamination Certificate

active

07842146

ABSTRACT:
An adhesive is contacted with a surface of a substrate and ultrasonic energy is applied to the adhesive to enhance the bonding of the adhesive to the surface of the substrate. The ultrasonic energy, particularly ultrasonic vibrations, can assist the adhesive in wetting the substrate surface, curing, polymerization or the like to enhance bonding.

REFERENCES:
patent: 3317433 (1967-05-01), Herman
patent: 4091130 (1978-05-01), Shaw
patent: 4100148 (1978-07-01), Hockenberger et al.
patent: 4373082 (1983-02-01), Kimball et al.
patent: 4390645 (1983-06-01), Hoffman et al.
patent: 4400497 (1983-08-01), Blum et al.
patent: 4461854 (1984-07-01), Smith et al.
patent: 4483974 (1984-11-01), Groegler et al.
patent: 4503161 (1985-03-01), Korbel et al.
patent: 4507469 (1985-03-01), Mita et al.
patent: 4528354 (1985-07-01), McDougal
patent: 4604444 (1986-08-01), Donnadieu et al.
patent: 4667008 (1987-05-01), Groegler et al.
patent: 4758648 (1988-07-01), Rizik et al.
patent: 4766176 (1988-08-01), Lee et al.
patent: 4778845 (1988-10-01), Tschan et al.
patent: 4780520 (1988-10-01), Rizik et al.
patent: 4788254 (1988-11-01), Kawakubo et al.
patent: 4837401 (1989-06-01), Hirose et al.
patent: 4950715 (1990-08-01), Duck et al.
patent: 4954472 (1990-09-01), Scott et al.
patent: 4990392 (1991-02-01), Groshens et al.
patent: 5102969 (1992-04-01), Schleffler et al.
patent: 5120349 (1992-06-01), Stewart et al.
patent: 5129180 (1992-07-01), Stewart
patent: 5194460 (1993-03-01), Evans et al.
patent: 5194488 (1993-03-01), Piestert et al.
patent: 5539045 (1996-07-01), Potts et al.
patent: 5601761 (1997-02-01), Hoffman et al.
patent: 5603798 (1997-02-01), Bhat
patent: 6054001 (2000-04-01), Swanson et al.
patent: 6224793 (2001-05-01), Hoffman et al.
patent: 6355127 (2002-03-01), Mahdi et al.
patent: 6613816 (2003-09-01), Mahdi et al.
patent: 2002/0010272 (2002-01-01), Mahdi et al.
patent: 2006/0225842 (2006-10-01), Darcy et al.
patent: 21 139 61 (1994-10-01), None
patent: 269 626 (1989-07-01), None
patent: 41 116 54 (1992-10-01), None
patent: 1 462 497 (2004-09-01), None
patent: 06 252554 (1994-09-01), None
patent: 94 182 55 (1994-08-01), None
patent: 96 276 41 (1996-09-01), None
patent: 98 111 66 (1998-03-01), None
International Search Report and Written Opinion for corresponding PCT, Application No. PCT/US2007/088584, dated Dec. 21, 2007.
Preliminary Report for corresponding PCT, Application No. PCT/US2007/088584, dated Dec. 21, 2007.

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