Ultrasonic dip soldering process

Metal fusion bonding – Process – With shaping

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

291573R, 228183, 228259, 228262, B23K 300

Patent

active

040761673

ABSTRACT:
Apparatus for venting a plate fin coil during the ultrasonic soldering of aluminum return bend tubes to the heat exchange tubes in the coil. The apparatus includes a process snorkel member comprising a bored plug for telescoping inside an extension tube extending from an open end of a heat exchange tube forming an end of a circuit in the coil, and a venting tube defining an air conduit from the plug to the atmosphere, whereby the pressure in the interior of the plate fin coil assembly is relieved when the fin coil is immersed in the solder bath.

REFERENCES:
patent: 1931311 (1933-10-01), Young
patent: 2120067 (1938-06-01), Gray et al.
patent: 3466738 (1969-09-01), Mount
patent: 3497946 (1970-03-01), Tingley, Jr.
patent: 3833986 (1974-09-01), DeCicco

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ultrasonic dip soldering process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic dip soldering process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic dip soldering process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1671150

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.