Ultrasonic conditioning device cleaner for chemical...

Abrading – Machine – Combined

Reexamination Certificate

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Details

C451S056000, C451S285000, C451S444000

Reexamination Certificate

active

06908371

ABSTRACT:
A method and system for cleaning conditioning devices used in chemical mechanical polishing (CMP) systems is disclosed. The system includes a robotic arm for holding and transporting the conditioning device between the polish pad area of the machine and the conditioning device cleaning area. The cleaning area consists of an ultrasonic tank containing a liquid for the purpose of removing particles, residues and contaminants from the conditioning device and its mounting hardware. Removal of contaminants from the conditioning device leads to reduced defect levels in the CMP process.

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