Ultrasonic chip removal method and apparatus

Details Ultrasonic chip removal method and apparatus Ultrasonic chip removal method and apparatus

1997-01-06

1998-07-21

Bradley, P. Asutin

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 19, 29762, 310333, B23K 1018

Patent

active

057824037

ABSTRACT:
A device for removal of a semiconductor chip interconnected to a substrate package via solder ball connections, for instance, includes an ultrasonic transducer for providing lateral ultrasonic vibration. A converter is coupled between the ultrasonic transducer and semiconductor chip for converting the lateral ultrasonic vibration to a torsional ultrasonic vibration, wherein the torsional ultrasonic vibration is perpendicular to the lateral ultrasonic vibration. The lateral-to-torsional converter further applies the torsional ultrasonic vibration to the chip for facilitating its removal from the substrate package. A method for removal of a semiconductor chip interconnected to a substrate package is also disclosed.

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patent: 5172469 (1992-12-01), Onda et al.
patent: 5216803 (1993-06-01), Nolan et al.
patent: 5326014 (1994-07-01), Morita et al.
patent: 5662766 (1997-09-01), Ishikawa et al.
"Use of Ultrasonics for Integrated Circuit Chip Removal," IBM Technical Disclosure Bulletin, vol. 23, No. 3 Aug. 1980, p. 979.
"Ultrasonic Method to Remove Chips Mounted on Ceramic or of Other Materials Substrates," Research Disclosure, Aug. 1991, No. 328.
"Ultrasonic Chip Removal from Burn-In Substrates," Research Disclosure, May 1992, No. 337.

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