Ultrasonic bonding process for making a microfluid device

Metal working – Method of mechanical manufacture – Fluid pattern dispersing device making – e.g. – ink jet

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S025350, C029S843000, C029S840000, C228S110100

Reexamination Certificate

active

06928731

ABSTRACT:
A piezoelectric ceramic ink-jet print head is made by an inventive ultrasonic bonding process. Specifically, there are several improved features of ink jet print heads, including a more cost-effective bonding process using an ultrasonic bonding technique, an improved piezoelectric ceramic crystal pattern, and improved print head-piezoelectric electrical contacts. Further, there is an ultrasonic bonding process joining metallic objects with ultrasonic energy.

REFERENCES:
patent: 4451541 (1984-05-01), Beal
patent: 4460906 (1984-07-01), Kanayama
patent: 4883219 (1989-11-01), Anderson et al.
patent: 4897903 (1990-02-01), Johannsen
patent: 5116783 (1992-05-01), Tsumura
patent: 5186378 (1993-02-01), Alfaro
patent: 5455615 (1995-10-01), Burr et al.
patent: 5626777 (1997-05-01), Hügl et al.
patent: 5669125 (1997-09-01), Shida
patent: 5689291 (1997-11-01), Tence et al.
patent: 5889539 (1999-03-01), Kamoi et al.
patent: 5921460 (1999-07-01), Topping et al.
patent: 6140743 (2000-10-01), Kishima et al.
patent: 0 357 020 (1989-08-01), None
patent: 0613196 (1994-08-01), None
patent: 06320738 (1994-11-01), None
patent: 08168889 (1996-07-01), None
Hayes et al., “Micro-Jet Printing of Polymers for Electronics Manufacturing”, Proceedings of International Conference on Adhesive Joining and Coating Technology in Electronics Maunfacturing, 1998, Sep. 1998, pp. 168-173.
Faridi, Hamid R., Devletian, J.H., Le, Hue P., “A New Look at Flux-Free Ultrasonic Soldering,” Welding Journal, vol. 42, Sep. 2000, pp. 41-45.
Irving, Bob, “The Search is On for Lead Replacements for Electronics Soldering Lines,” Welding Journal, Oct. 1999, pp. 55-60.
Le, Hue P., “Progress and Trends in Ink-Jet Printing Technology,” Journal of Imaging Science and Technology, 42(1), Jan./Feb. 1998.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ultrasonic bonding process for making a microfluid device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic bonding process for making a microfluid device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic bonding process for making a microfluid device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3460537

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.