Ultrasonic bonding process

Details Ultrasonic bonding process Ultrasonic bonding process

1995-01-17

1997-08-26

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

228 11, H01L 21607

Patent

active

056603193

ABSTRACT:
A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).

REFERENCES:
patent: 5186378 (1993-02-01), Alfaro
patent: 5201454 (1993-04-01), Alfaro et al.
patent: 5244140 (1993-09-01), Ramsey et al.
Japan Inst. Metals, vol. 57, No. 8 (1993) pp. 884-889--Effect of Ultasonic Vibration on Wire Bonding, Hiroshi Haji et al.
ICEMM Proceedings 1993, pp. 336-377, High Reliability Bonding Technology by the 120KHz Frequency of Ultrasonic, Yuji shirai et al.
Autom. Weld, "Ultrasonic Microwelding at a Frequency of 245kHz", E.G. Konovalov and V.S. Galkov, vol. 23, No. 6, pp. 64, 65, Jun. 1970.

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