Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate
2005-08-30
2005-08-30
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
With condition responsive, program, or timing control
C228S001100, C228S004500, C228S008000, C228S110100, C228S180500
Reexamination Certificate
active
06935551
ABSTRACT:
Intersected portions (C) of coated electric wires20and (21) are sandwiched and pressurized between a horn-side chip (11) and an anvil-side chip (12) (sandwiching step). Ultrasonic vibration force determined by a first vibration condition is applied to the horn-side chip (11) to melt insulators (20a) and (21a) of the coated electric wires (20) and (21) (insulator-melting step). A time point when conductors (20b) and (21b) of the coated electric wires (20) and (21) come into contact with each other is automatically detected by the melting of the insulators (20a) and (21a) (conductor contact-detecting step). After the conductors came into contact with each other, ultrasonic vibration force determined by a second vibration condition is applied to the horn-side chip (11), thereby bonding the conductors (20b) and (21b) to each other (conductor-bonding step).
REFERENCES:
patent: 3734382 (1973-05-01), Spanjer
patent: 4047992 (1977-09-01), Williams et al.
patent: 4597519 (1986-07-01), Kurtz et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 5110032 (1992-05-01), Akiyama et al.
patent: 5115960 (1992-05-01), Shimizu
patent: 5192015 (1993-03-01), Ingle et al.
patent: 5433369 (1995-07-01), Okumura
patent: 5923202 (1999-07-01), Merrill
patent: 5931372 (1999-08-01), Miller
patent: 6019271 (2000-02-01), Hayden et al.
patent: 6152350 (2000-11-01), Hayashi et al.
patent: 6226865 (2001-05-01), Tanikawa et al.
patent: 6609648 (2003-08-01), Kondo
patent: 6662445 (2003-12-01), Tanikawa et al.
patent: 6786392 (2004-09-01), Nogawa
patent: 2002/0130159 (2002-09-01), Kondo
patent: 2004/0232208 (2004-11-01), Kondo
patent: 196 36 217 (1998-03-01), None
patent: 0 540 189 (1993-05-01), None
patent: 406283579 (1994-10-01), None
patent: 9-29445 (1997-02-01), None
patent: 02002280140 (2002-09-01), None
U.S. Appl. No. 10/471,773, filed Sep. 16, 2003, Kondo.
Stoner Kiley S.
Yazaki -Corporation
LandOfFree
Ultrasonic bonding method of coated electric wires and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultrasonic bonding method of coated electric wires and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic bonding method of coated electric wires and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3522879