Ultrasonic bonding method and ultrasonic bonding apparatus

Details Ultrasonic bonding method and ultrasonic bonding apparatus Ultrasonic bonding method and ultrasonic bonding apparatus

1996-07-26

1999-03-23

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

228 45, H01L 21607

Patent

active

058848355

ABSTRACT:
In a case of ultrasonic bonding of a bonding wire to a metal pad provided on a semiconductor substrate, the vibration amplitude of a tip end of the bonding tool is set to be smaller than the film thickness of the metal pad, and the vibration frequency of the bonding tool is set to be higher than 70 kHz. According physical damage, such as cracks produced in a portion beneath the metal pad, can be prevented.

REFERENCES:
patent: 5360155 (1994-11-01), Ooki et al.
patent: 5431324 (1995-07-01), Kajiwara et al.
patent: 5494207 (1996-02-01), Asanasavest
patent: 5626276 (1997-05-01), Lo et al.

Affiliated with

Also associated with

Rating

Ultrasonic bonding method and ultrasonic bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic bonding method and ultrasonic bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic bonding method and ultrasonic bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2118227