Ultrasonic bonding method and device

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S110100, C156S580100, C156S580200

Reexamination Certificate

active

07017791

ABSTRACT:
In an ultrasonic bonding method that bonds a material to a bonding surface by the application of ultrasonic vibration, both side faces of the material in the direction of ultrasonic vibration are clamped by an application member that applies a predetermined ultrasonic vibration, and by a clamping member. The clamping member is synchronously vibrated by ultrasonic vibration transmitted through the material from the application member, and the material is bonded to the bonding surface while being pressed against the application member and against the bonding surface. In this method, high bonding quality can be achieved by efficiently transmitting ultrasonic vibration from the application member to a material to be bonded, and the material can be prevented from tilting, cracking, chipping, or the like without being subjected to a special working operation, for example, forming of a chamfered portion.

REFERENCES:
patent: 4821945 (1989-04-01), Chase et al.
patent: 5460320 (1995-10-01), Belcher et al.
patent: 5651494 (1997-07-01), Ogino et al.
patent: 5826407 (1998-10-01), Giacomelli et al.
patent: 6273980 (2001-08-01), Akiyama et al.
patent: 6357506 (2002-03-01), Nomura et al.
patent: 6517652 (2003-02-01), Gratz
patent: 2003/0160084 (2003-08-01), Higashiyama
patent: 1 011 127 (2000-06-01), None
patent: 1 074 330 (2001-02-01), None
patent: 59-208844 (1984-11-01), None
patent: 1-244630 (1989-09-01), None
patent: 2001-44242 (2001-02-01), None
patent: 2001-110850 (2001-04-01), None
patent: 2001-127114 (2001-05-01), None
Korean Office Action issued Aug. 26, 2005.
European Search Report issued Jul. 1, 2005.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ultrasonic bonding method and device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic bonding method and device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic bonding method and device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3533707

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.