Ultrasonic bonding method and apparatus with locking tool tip

Details Ultrasonic bonding method and apparatus with locking tool tip Ultrasonic bonding method and apparatus with locking tool tip

1997-02-14

1999-08-03

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 11, 228 45, 228 45, B23K 2010, H01L 2160

Patent

active

059313722

ABSTRACT:
An ultrasonic bonding method and apparatus utilizes a locking mechanism which limits motion of an ultrasonic bonding tool tip during formation of a bond. In a basic embodiment of tie invention, motion of the tool tip in the up/down, z-axis direction is inhibited during bond formation. Preferably motion in the longitudinal, in/out y-axis direction is also inhibited, and motion in the lateral, x-direction may optionally be limited. A separate locking mechanism or brake is provided for each orthogonal direction in which it is desired to inhibit motion during bond formation. Each brake is actuated in response to a bond initiation command signal, locking the tool tip against motion in particular coordinate directions prior to application of ultrasonic energy to a bond site, and maintaining the tip in that position for a period sufficient to melt wire insulation, weld the stripped wire to a bond site such as the microcircuit pad or lead, and allow the weld to cool and solidify. At the end of the bond formation command signal, the brake command signal is removed, allowing the tool to be moved to another bond site.

REFERENCES:
patent: 3102331 (1963-09-01), Costa
patent: 3626590 (1971-12-01), Miller
patent: 4550871 (1985-11-01), Chan et al.
patent: 5386935 (1995-02-01), De Leon et al.

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