Ultrasonic bonding head

Details Ultrasonic bonding head Ultrasonic bonding head

1976-08-11

1977-12-20

Smith, Gary L.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, 228 441A, B23K 2102

Patent

active

040636739

ABSTRACT:
A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.

REFERENCES:
patent: 3216640 (1965-11-01), Szasz
patent: 3347442 (1967-10-01), Reber
patent: 3383757 (1968-05-01), Baker
patent: 3461538 (1969-08-01), Worcester
patent: 3627192 (1971-12-01), Killingsworth

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