Ultrasonic bonding head

Details Ultrasonic bonding head Ultrasonic bonding head

1976-08-16

1978-01-03

James, Andrew J.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

357 68, 357 70, 357 71, 228 45, 228 1R, 228 13, 228 18, 228179, 228180A, H01L 2348, H01L 2940, H01L 2944

Patent

active

040670392

ABSTRACT:
A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.

REFERENCES:
patent: 3116655 (1964-01-01), Esopi
patent: 3128648 (1964-04-01), Ciagett
patent: 3128649 (1964-04-01), Avila et al.
patent: 3190954 (1965-06-01), Pomerantz
patent: 3289452 (1966-12-01), Kollner
patent: 3347442 (1967-10-01), Reber
patent: 3680206 (1972-08-01), Roberts
patent: 3787966 (1974-01-01), Klossika
patent: 3941298 (1976-03-01), Nicklaus

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