Ultrasonic bonding apparatus and quality monitoring method

Details Ultrasonic bonding apparatus and quality monitoring method Ultrasonic bonding apparatus and quality monitoring method

1993-01-22

1995-07-11

Bradley, P. Austin

Metal fusion bonding

Process

With condition responsive, program, or timing control

228103, 2281101, 228 11, B23K 2010

Patent

active

054313244

ABSTRACT:
An ultrasonic bonding apparatus comprises an ultrasonic wave controller, a bonding system including a bonding head, a laser oscillator, a laser optics, a vibration monitoring system including a vibrometer, and a mechanism for feeding a result of monitoring back to a bonding condition.

REFERENCES:
patent: 3153850 (1964-10-01), Worlton et al.
patent: 3763545 (1973-10-01), Spanjer
patent: 4834111 (1989-05-01), Khanna et al.
patent: 5199630 (1993-04-01), Felber et al.

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