Ultrasonic bonding apparatus

Details Ultrasonic bonding apparatus Ultrasonic bonding apparatus

2009-09-22

2010-11-02

Sells, James (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S073100, C156S281000, C156S361000, C156S494000

Reexamination Certificate

active

07823618

ABSTRACT:
An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

REFERENCES:
patent: 6502327 (2003-01-01), Kume et al.
patent: 2010/0006621 (2010-01-01), Masuda et al.
patent: 2010/0038406 (2010-02-01), Masuda et al.
patent: 56-003447 (1981-01-01), None
patent: 60-234282 (1985-11-01), None
patent: 02-260552 (1990-10-01), None
patent: 04-090115 (1992-03-01), None
patent: 05-345411 (1993-12-01), None
patent: 06-038828 (1994-10-01), None
patent: 08-195063 (1996-07-01), None
patent: 08-264584 (1996-10-01), None
patent: 2562897 (1998-02-01), None
patent: 2001-030465 (2001-02-01), None
patent: 2002-053110 (2002-02-01), None
patent: 2002-313837 (2002-10-01), None
patent: 2003-249793 (2003-09-01), None
patent: 2004-207294 (2004-07-01), None
patent: 2004-342847 (2004-12-01), None
patent: 2005-072033 (2005-03-01), None
patent: 2005-302750 (2005-10-01), None
International Search Report for PCT/JP2007/056563, Mailing Date of May 22, 2007.

Affiliated with

Also associated with

Rating

Ultrasonic bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultrasonic bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrasonic bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4251158