Ultrasonic bonding apparatus

Details Ultrasonic bonding apparatus Ultrasonic bonding apparatus

2011-03-15

2011-03-15

Sells, James (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S073100, C156S281000, C156S378000

Reexamination Certificate

active

07905268

ABSTRACT:
An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

REFERENCES:
patent: 2010/0006231 (2010-01-01), Masuda et al.
patent: 2010/0006621 (2010-01-01), Masuda et al.
patent: 2010/0038406 (2010-02-01), Masuda et al.

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