Ultrasonic bonding apparatus

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With testing – measuring – and/or indicating means

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Details

73 671, 73 672, 73 714, 156 732, 156380, 156580, 228 1B, 228110, 310314, B23K 106

Patent

active

040408850

ABSTRACT:
Apparatus for non-destructively monitoring the bonding quality of an ultrasonic bonding system by detecting the amplitude deviation of a vibrating bonding tool between the vibration amplitude thereof in the freely vibrating (no-load) condition and the vibration amplitude during an ultrasonic bonding operation.

REFERENCES:
patent: 3302454 (1967-02-01), Kleesattel
patent: 3307393 (1967-03-01), Kessler
patent: 3323352 (1967-06-01), Branson
patent: 3489241 (1970-01-01), Steinberg
patent: 3573781 (1971-04-01), Shoh
patent: 3727822 (1973-04-01), Umbaugh
patent: 3794236 (1974-02-01), Salzer et al.
patent: 3827619 (1974-08-01), Cusick et al.
patent: 3852999 (1974-12-01), Wright
patent: 3857279 (1974-12-01), Salzer
patent: 3863827 (1975-02-01), Foulke et al.
patent: 3955404 (1976-05-01), Bickel et al.

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