Ultrasonic bond testing of semiconductor devices

Details Ultrasonic bond testing of semiconductor devices Ultrasonic bond testing of semiconductor devices

1981-03-25

1983-01-04

Kreitman, Stephen A.

Measuring and testing

Vibration

By mechanical waves

73588, G01N 2904

Patent

active

043667139

ABSTRACT:
The bond between a structured copper heat sink member and a semiconductor wafer is inspected for voids and unbonds by a focused ultrasonic pulse transmission method. The small focused spot of ultrasound is transmitted along the structured copper strands and is attenuated in the lateral direction. The absence of a received pulse or a significantly reduced amplitude signal, as the assembled device is scanned with acoustic pulses, indicate flaws in the bond.

REFERENCES:
patent: 3295089 (1966-12-01), Moore
patent: 3584327 (1971-06-01), Murray
patent: 4008602 (1977-02-01), Love
patent: 4011748 (1977-03-01), Bond et al.
patent: 4252263 (1981-02-01), Houston
Wang et al., 1977 Ultrasonics Symposium Proceedings, IEEE Cat. No. 77CH1264-ISU, pp. 171-175.
Gilmore et al., Materials Evaluation, vol. 37, No. 1, Jan. 1979, pp. 65-72.

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