Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1980-08-25
1982-07-27
Wityshyn, Michael G.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 731, 156 732, 156378, 1565801, 228110, 228 1R, B23K 106, B29C 2708
Patent
active
043415741
ABSTRACT:
A monitor for optimizing the ultrasonic bonding of materials by analyzing the impedance of an ultrasonic transducer used to effect the bond. The electrical impedance of the transducer, which is proportional to its mechanical impedance, is determined by applying an ultrasonic voltage thereto and monitoring the resultant change in current amplitude. A pair of differentiators produces a second derivative signal of the impedance with respect to time, with a negative-going zero crossing of this signal corresponding to completion of the bond. Loss of wire, mechanical malfunctions and improper bonds are also detected by the monitor, to form a real time quality control system.
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Donaldson Richard L.
Lashmit Douglas A.
Sharp Mel
Texas Instruments Incorporated
Wityshyn Michael G.
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