Ultrasonic bond energy monitor

Details Ultrasonic bond energy monitor Ultrasonic bond energy monitor

1980-08-25

1982-07-27

Wityshyn, Michael G.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 731, 156 732, 156378, 1565801, 228110, 228 1R, B23K 106, B29C 2708

Patent

active

043415741

ABSTRACT:
A monitor for optimizing the ultrasonic bonding of materials by analyzing the impedance of an ultrasonic transducer used to effect the bond. The electrical impedance of the transducer, which is proportional to its mechanical impedance, is determined by applying an ultrasonic voltage thereto and monitoring the resultant change in current amplitude. A pair of differentiators produces a second derivative signal of the impedance with respect to time, with a negative-going zero crossing of this signal corresponding to completion of the bond. Loss of wire, mechanical malfunctions and improper bonds are also detected by the monitor, to form a real time quality control system.

REFERENCES:
patent: 3153850 (1964-10-01), Worlton et al.
patent: 3212695 (1965-10-01), MacGregor
patent: 3573781 (1971-04-01), Shoh
patent: 3784079 (1974-01-01), Spanjer
patent: 3794236 (1974-02-01), Salzer et al.
patent: 3827619 (1974-08-01), Cusick et al.
patent: 4040885 (1977-08-01), Hight et al.

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