Ultrasonic apparatus and method of simultaneously inspecting mic

Measuring and testing – Vibration – By mechanical waves

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G01N 2904

Patent

active

060325348

ABSTRACT:
An apparatus and method of locating defects within microcomponents using ultrasonic technology. A pulse-echo mode transducer and a through-transmission mode transducer are arranged around a component in order to introduce ultrasonic sound waves to perform inspections of both sides of the component to be tested which reduces the overall testing time by simultaneously providing a composite image of both sides of the component. By eliminating a scan process, an increase of the rate at which components are inspected is achieved.

REFERENCES:
patent: 5079951 (1992-01-01), Raymond et al.
patent: 5600068 (1997-02-01), Kessler et al.
patent: 5684252 (1997-11-01), Kessler et al.

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