Ultrasonic adhesion/dehesion monitoring apparatus with power fee

Details Ultrasonic adhesion/dehesion monitoring apparatus with power fee Ultrasonic adhesion/dehesion monitoring apparatus with power fee

1992-05-29

1993-05-25

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228110, 228 11, 228 8, 156 732, 1565801, 73582, H01L 21607

Patent

active

052132498

ABSTRACT:
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; b. means for measuring the instantaneous AC current and instantaneous AC supplied to said ultrasonic source; c. means for multiplying the instantaneous AC voltage and the instantaneous AC current to determine the instantaneous power supplied to said ultrasonic source; and d. monitor means coupled to said ultrasonic source and said power determining means for monitoring the instantaneous power supplied to said ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.

REFERENCES:
patent: 4341574 (1982-07-01), Landes
patent: 4606490 (1986-08-01), Chan et al.
patent: 4746051 (1988-05-01), Peter
patent: 4815001 (1989-03-01), Uthe et al.
patent: 5046654 (1991-09-01), Yamazaki et al.
J. R. Behun, et al., IBM Research Disclosure, Entitled "Ultrasonic Method to Remove Chips Mounted on Ceramic or of Other Materials Substrates", Aug. 1991, No. 328.

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