Ultrasonic adhesion/dehesion monitoring apparatus with acoustic

Details Ultrasonic adhesion/dehesion monitoring apparatus with acoustic Ultrasonic adhesion/dehesion monitoring apparatus with acoustic

1992-05-29

1992-12-15

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228104, 228264, 228 9, 156 731, 156378, 73587, 73588, H01L 21607

Patent

active

051709295

ABSTRACT:
An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the quality and/or adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (b) acoustic transducer means proximate to the ultrasonic source and/or the substrates; and (c) monitor means coupled to the acoustic transducer means for monitoring the ultrasonic signal from the ultrasonic source. Also disclosed is a method for monitoring the quality and/or adhesion/dehesion between first and second substrates in the ultrasonic adhesion/dehesion monitoring apparatus.

REFERENCES:
patent: 3784079 (1974-01-01), Spanjer
patent: 4040885 (1977-08-01), Hight et al.
patent: 4373653 (1983-02-01), Salzer et al.
patent: 4419562 (1983-12-01), Jon et al.
patent: 4586642 (1986-05-01), Dreibelbis et al.
patent: 4696708 (1987-09-01), Keller et al.
patent: 4746051 (1988-05-01), Peter
Welding Design and Fabrication, "Acoustical Holography Looks Through Welds", William G. Ehlman, pp. 68-70, Feb. 1977.
J. R. Behun, et al., IBM Research Disclosure, Entitled: "Ultrasonic Method to Remove Chips Mounted on Ceramic or Other Materials Substrates" Aug. 1981 No. 328.

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