Ultrahigh molecular weight polyethylene composite for printed ci

Details Ultrahigh molecular weight polyethylene composite for printed ci Ultrahigh molecular weight polyethylene composite for printed ci

1997-12-01

1999-10-26

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428297, 4282977, 4282981, 428458, 428901, 174254, 174258, 442232, 442378, B32B 300, B32B 506

Patent

active

059724846

ABSTRACT:
An ultrahigh molecular weight polyethylene composite for a printed circuit board or antenna base material, a base material including the composite and electronic modules including the base material. The base material includes at least one dielectric layer including an ultrahigh molecular weight polyethylene composite and at least one electroconductive layer including an electroconductive material, the dielectric and electroconductive layers being intimately bonded to one another.

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Cordova et al, "A Review of Ultra High Modulus Polyethylene Fiber Reinforced Composites for Electromagnetic Window Applications", Proc. Int'l. SAMPE Symposium (Feb. 9-12, 1992), pp. 1406-1420.

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