Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent
1994-10-13
1999-12-07
Jackson, Jr., Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
257746, 257686, 257777, 359245, 359254, 359295, H01L 2348, G02F 100
Patent
active
059988746
ABSTRACT:
Metal heated to a molten state is injected under a high hydrostatic penetration pressure into extremely small and closely spaced channels of an insulating matrix to form an array of electrically conductive pins or wires. The materials for the pins and matrix are selected for compatibility with respect to melting, matrix sintering and surface tension penetration conditions associated with the fabrication of a high density charge transfer device.
REFERENCES:
patent: 4499655 (1985-02-01), Anthony
patent: 4946592 (1990-08-01), Galaj et al.
patent: 5087278 (1992-02-01), Suzuki
patent: 5287215 (1994-02-01), Warde et al.
Warde et al, Applied Optics vol. 31 No. 20 Jul. 10, 1992 pp. 3971-3979 "Cge--transfer--plate spatial light modulators".
Caviris Nicholas
Huber Carmen I.
Huber Tito E.
Forrest John
Jackson, Jr. Jerome
Shuster Jacob
The United States of America as represented by the Secretary of
LandOfFree
Ultrahigh density charge transfer device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultrahigh density charge transfer device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrahigh density charge transfer device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-827274