Metal treatment – Stock – Copper base
Reexamination Certificate
2005-05-24
2005-05-24
Ip, Sikyin (Department: 1742)
Metal treatment
Stock
Copper base
C148S433000, C148S434000, C148S435000, C148S436000, C428S211100, C204S298130, C156S922000
Reexamination Certificate
active
06896748
ABSTRACT:
The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at least about 10 percent each of (111), (200), (220) and (311). In addition, the sputter target has a grain size of less than about 10 μm for improving sputter uniformity and reducing sputter target arcing.
REFERENCES:
patent: 4083220 (1978-04-01), Kobayashi et al.
patent: 4159217 (1979-06-01), Selines et al.
patent: 4695348 (1987-09-01), Battey et al.
patent: 4777078 (1988-10-01), Miyabayashi
patent: 5456815 (1995-10-01), Fukuyo et al.
patent: 5600989 (1997-02-01), Segal et al.
patent: 5766380 (1998-06-01), Lo et al.
patent: 5993575 (1999-11-01), Lo et al.
patent: 5993621 (1999-11-01), Liu
patent: 6139701 (2000-10-01), Pavate et al.
patent: 6197129 (2001-03-01), Zhu et al.
patent: 20010023726 (2001-09-01), Koenigsmann et al.
patent: 799905 (1997-10-01), None
patent: 3115562 (1991-05-01), None
patent: 0015863 (2000-03-01), None
Rigney et al., “Deformation Substructures Associated with Very Large Plastic Strains”, Scripta Metallurgica, vol. 27 (1992) pp 975-980.
Valiev et al., “Structure and Mechanical Behavior of Ultrafine-Grained Metals and Alloys Subjected to Intense Plastic Deformation”, Physics of Metals and Metallography, vol. 85, No. 3 (1998) pp 367-377.
Nakashima et al., “Influence of Channel Angle on the Development of Ultrafine Grains in Equal-Channel Angular Pressing”, Acta Metallurgica, vol. 46, No. 5 (1998) pp 1589-1599.
Shin et al., “Grain Refinement of a Commerical 0.15%C Steel by Equal-Channel Angular Pressing”, Scripta Metallurgica, vol. 41, No. 3 (1999) pp 259-262.
Tsuji et al., “Ultra-Fine Grained Bulk Steel Product by Accumutative Roll-Bonding (ARB) Process”, Scripta Metallurgica, vol. No. 7 (1999) pp 795-800.
Sun et al., “Characteristics of Submicron Grained Structure Formed in Aluminum by Equal Channel Angular Extrustion”, Materials Science and Engineering (2000) pp 82-85.
Gilman Paul S.
Perry Andrew C.
Ip Sikyin
Praxair S.T. Technology, Inc.
Schwartz Iurie A.
LandOfFree
Ultrafine-grain-copper-base sputter targets does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultrafine-grain-copper-base sputter targets, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultrafine-grain-copper-base sputter targets will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3433935