Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-06-13
2010-06-01
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S118000, C257SE21505, C257SE23010
Reexamination Certificate
active
07727808
ABSTRACT:
A method for forming an ultra thin die electronic package includes disposing a first polymer film on a first substrate, applying a first adhesive layer to the first polymer film, disposing at least one die on the first adhesive layer, disposing a second polymer film on at least one additional substrate, applying a second adhesive layer to the second polymer film on at least one additional substrate, applying a second adhesive layer to the second polymer film, and attaching the first substrate and the at least one additional substrate via the first adhesive layer and the second adhesive layer such that the at least one die is interspersed between. The method also includes forming multiple vias on a top and/or bottom side of the first and the additional substrate(s), wherein the multiple vias are directly connected to the die, and forming an electrical interconnection between the first substrate, the at least one additional substrate and a die pad of the at least one die.
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Durocher Kevin Matthew
Iannotti Joseph Alfred
Kapusta Christopher James
General Electric Company
Klindtworth Jason K.
Landau Matthew C
Wolverton Daren
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