Ultra-thick thick films for thermal management and current carry

Details Ultra-thick thick films for thermal management and current carry Ultra-thick thick films for thermal management and current carry

1993-03-29

1995-03-07

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 361706, 361774, B32B 900

Patent

active

053956796

ABSTRACT:
Disclosed is an ultra-thick thick film of copper or silver or other suitable conductor material for use in spreading heat laterally, i.e., in the x and y directions, along a substrate. A substrate of suitable thickness is chosen to dissipate heat in the vertical or z-direction underneath a heat generating component such as a semiconductor chip. The ultra-thick films have a thickness ranging from about 2 to about 5 mils and are prepared from metal powders having average particles sizes ranging from about 1 micron to 3 microns.

REFERENCES:
patent: 4612601 (1986-09-01), Watari
patent: 5121298 (1992-06-01), Sarma et al.
patent: 5173839 (1992-12-01), Metz, Jr.
449-F&M Feinwerktechnik & Messtechnik 98 (1990) Nov., No. 11, Munchen, DE.

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