Metal working – Method of mechanical manufacture – Electrical device making
Patent
1990-11-09
1992-03-03
Hannaher, Constantine
Metal working
Method of mechanical manufacture
Electrical device making
250332, 2503381, 250349, 357 68, H05K 330, H05K 334
Patent
active
050920367
ABSTRACT:
Method for improving particular interconnect pads for microcircuitry so that they provide more compliant interconnections between opposed pairs of contacts of the microchips in a hybrid detector array assembly. The individual tubes of prior art interconnect pads are filled with indium and are then etched away to leave indium columns of increased height, relative to the indium bumps that have heretofore been used in the contact connections of hybrid detector array assemblies. Other materials may be substituted for the indium and a number of variants of the process are also disclosed.
REFERENCES:
patent: 4067104 (1978-01-01), Tracy
patent: 4072863 (1978-02-01), Roundy
patent: 4197469 (1980-04-01), Cheung
patent: 4354109 (1982-10-01), Gelpey et al.
patent: 4467340 (1984-08-01), Rode et al.
patent: 4670653 (1987-06-01), McConkle et al.
patent: 4675525 (1987-06-01), Amingual et al.
patent: 4703559 (1987-11-01), Ehrfeld et al.
patent: 4740700 (1988-04-01), Shaham et al.
patent: 4862588 (1989-09-01), Mackay
D'Agostino Saverio A.
Hu William C.
Longerich Ernest P.
Brown C. D.
Denson-Low W. K.
Glick Edward J.
Hannaher Constantine
Heald R. M.
LandOfFree
Ultra-tall indium or alloy bump array for IR detector hybrids an does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultra-tall indium or alloy bump array for IR detector hybrids an, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultra-tall indium or alloy bump array for IR detector hybrids an will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-263435