Ultra-tall indium or alloy bump array for IR detector hybrids an

Metal working – Method of mechanical manufacture – Electrical device making

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250332, 2503381, 250349, 357 68, H05K 330, H05K 334

Patent

active

050920367

ABSTRACT:
Method for improving particular interconnect pads for microcircuitry so that they provide more compliant interconnections between opposed pairs of contacts of the microchips in a hybrid detector array assembly. The individual tubes of prior art interconnect pads are filled with indium and are then etched away to leave indium columns of increased height, relative to the indium bumps that have heretofore been used in the contact connections of hybrid detector array assemblies. Other materials may be substituted for the indium and a number of variants of the process are also disclosed.

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