Ultra-short low-force vertical probe test head and method

Details Ultra-short low-force vertical probe test head and method Ultra-short low-force vertical probe test head and method

2006-11-07

2006-11-07

Zarneke, David (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010

Reexamination Certificate

active

07132839

ABSTRACT:
A method and apparatus for making a probe head that is very short (in the direction vertical) and exerts low force on the contacts of the circuit being tested, and on its own pins. The probe head is moved in the vertical direction to contact the IC being tested. Each pin is in sliding contact with an electrical contact on a space-transformer substrate, such as a post that slides within a sleeve. Each pin is also held in a diaphragm, such as an elastic membrane, in order to provide gentle force of the pin against the contact point of the circuit being tested. One or more walls or supports around each pin hold portions of the diaphragm in place so a deflection of one pin will not lift neighboring pins off their contacts.

REFERENCES:
patent: 4724383 (1988-02-01), Hart
patent: 5252916 (1993-10-01), Swart
patent: 5389885 (1995-02-01), Swart
patent: 6084421 (2000-07-01), Swart et al.
patent: 6356098 (2002-03-01), Akram et al.
“COBRA Vertical Technology Probe Cards”, Available from http://www.wentworthlabs.com/product/cobra.htm, 3 pages.
“Yield-Enhancing WaferProbe PH-Series Probe Cards”, Available from http://www.formfactor.com/FormFactor%20Online/downloadables/WaferProbe%20PH-Series.pdf, 2 pages.

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