Ultra-miniature accelerometers

Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element

Reexamination Certificate

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Details

C607S057000, C600S025000, C623S010000

Reexamination Certificate

active

07104130

ABSTRACT:
A miniaturized micromachined (MEMS) accelerometer-based sensor suitable for use in biological applications, such as a middle ear implant, is provided. An encapsulation layer is deposited on top of an accelerometer proof mass and flexure prior to release of the proof mass and flexure. The encapsulation layer protects the proof mass and flexure from subsequent processing steps, such as dicing and packaging, which enables fabrication of finished devices having reduced size. Surfaces within the accelerometer may be passivated after releasing the proof mass and flexure. Remote piezoresistive sensing is performed in order to provide low noise and reduced sensor head size.

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Aaron Partridge et al., “New Thin Film Epitaxial Polysilicon Encapsulation For Piezoresistive Accelerometers,” Proceedings 2001 IEEE Int'l. Conference on MicroElectromechanical Systems, p. 54-59.
Woo-Tae Park et al., “Wafer-Scale Film Encapsulation Of Micromachined Accelerometers,” IEEE Proceedings Transducers, Jun. 2003.
Aaron Partridge et al., “A High-Performance Planar Piezoresistive Accelerometer,” Journal of Microelectromechanical Systems, vol. 9, No. 1, Mar. 2000, pp. 58-66.

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