Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1997-01-15
1999-12-21
Coe, Philip R.
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
134 254, 134 30, 134 952, 134902, B08B 308
Patent
active
060043997
ABSTRACT:
A method is described for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance also is included. It is believed that the cleaning enhancement substance dopes any liquid adhered to the front and back faces of the wafer to cause a concentration gradient of the cleaning enhancement substance in the liquid and accelerate removal of the adhered liquid off of the water.
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Bamnolker Hanna
Bhushan Rajiv
Elmore Gary
Mohindra Raj
Puri Suraj
Coe Philip R.
Cypress Semiconductor Corporation
Kelber Steven B.
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