Cleaning and liquid contact with solids – Processes – Work handled in bulk or groups
Patent
1998-09-04
2000-12-12
Gulakowski, Randy
Cleaning and liquid contact with solids
Processes
Work handled in bulk or groups
134 2, 134 21, 134 255, 134 26, 134 30, 134 37, 134902, B08B 920
Patent
active
061584460
ABSTRACT:
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid comprising water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas comprising a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.
REFERENCES:
patent: 5421905 (1995-06-01), Ueno et al.
patent: 5571337 (1996-11-01), Mohindra et al.
patent: 5634978 (1997-06-01), Mohindra et al.
patent: 5772784 (1998-06-01), Mohindra et al.
Anderson Sr. John H.
Bhushan Abhay
Bhushan Rajiv
Mohindra Raj
Nowell Jeffrey
FSI International
Gulakowski Randy
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