Ultra-low-loss strip-type transmission lines, formed of bonded s

Wave transmission lines and networks – Long lines – Strip type

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333 99S, 505866, H01P 308

Patent

active

050756559

ABSTRACT:
A method of constructing ultra-low-loss miniaturized microstrip type microwave transmission lines, circuits, and resonators and their resulting structures are disclosed. The method includes etching a groove of the appropriate width and depth into the surface of a first substrate as determined by a preselected characteristic impedance. Appropriate thin film superconductors are then deposited on the surfaces of the first substrate and a second substrate. The thin film superconductors are then patterned after which the two substrates are sealed together by field-assisted thermal bonding such that a novel two-conductor electromagnetic transmission line results.

REFERENCES:
patent: 3142808 (1964-07-01), Gonda
patent: 3225351 (1965-12-01), Chatelain et al.
patent: 4379307 (1983-04-01), Soclof
patent: 4785271 (1988-11-01), Higgins, Jr.
Wallis, G. and Pomerantz, D.; "Field Assisted Glass-Metal Sealing"; Journal f Applied Physics; vol. 40, No. 10; pp. 3946-3949; Sep. 1969.

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