Ultra high-frequency circuit with metallized through hole

Details Ultra high-frequency circuit with metallized through hole Ultra high-frequency circuit with metallized through hole

1984-02-02

1986-01-07

Lawrence, Evan K.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

427 97, 428901, H05K 109

Patent

active

045635439

ABSTRACT:
An ultra high frequency circuit formed on an insulating plate having first and second surfaces on opposite sides and having at least one hole formed through the plate and defined by a side wall connecting the surfaces. The side wall is covered by a deposition including overlapping layers of gold and gold-platinum for connecting, respectively, a gold connection track on the one surface with a silver alloy conductive layer. The overlapping gold/gold-platinum layers provide metallurgically-stable interfaces with the gold connection track and the silver alloy conductive layer. This prevents a metallurgically unstable condition which would exist if the gold connection track were directly connected to the silver alloy conductive layer. .

REFERENCES:
patent: 3799802 (1974-03-01), Schneble, Jr. et al.
patent: 4001146 (1977-01-01), Horowitz
patent: 4069963 (1978-01-01), Prasad
patent: 4131516 (1978-12-01), Bakos et al.
Harper, Charles A., Handbook of Thick Film Hybrid Microelectronics, McGraw-Hill, 1974, pp. 4-34 and 4-35.

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