Ultra high frequency circuit with low parasite capacities

Wave transmission lines and networks – Long line elements and components – Strip type

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333247, H01P 308

Patent

active

047927739

ABSTRACT:
An ultra high frequency circuit constructed in hybrid or integrated form whose parasite capacities are greatly reduced. The ultra high frequency circuit has, besides the components, at least one component fixing metallization and at least one microstrip formed by a metal track, on a first face of a dielectric substrate and, a ground plane metallization on a second face of the substrate. The ultra high frequency circuit is fixed to the base of a case. In order to reduce the parasite capacities formed between metallizations, the second metallized face of the substrate is locally demetallized, in line with the fixing metallization, and an air layer is introduced between the demetallized substrate and the base of the case.

REFERENCES:
patent: 3659228 (1972-04-01), Napoli
patent: 4211986 (1980-07-01), Tajima
patent: 4251817 (1981-02-01), Kimura et al.
patent: 4375054 (1983-02-01), Pavio
patent: 4394633 (1983-07-01), Klein

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