Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-10-08
1995-05-30
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 163, 165 803, 165185, 257719, 361690, 361715, 361717, 361719, 361790, H05K 720
Patent
active
054207517
ABSTRACT:
A multiple-element modular package is provided which includes a plurality of level-one packages in horizontal or vertical stacked configuration.
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IBM Technical Disclosure Bulletin, vol. 22, No. 6, pp. 2336-2337 (Flexible Semiconductor Credit Card), no known date.
Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when this information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM MODULE and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM MODULE, pp. 865-870, no known date.
Staktek Corporation
Thompson Gregory D.
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