Ultra high density integrated circuit packages method and appara

Details Ultra high density integrated circuit packages method and appara Ultra high density integrated circuit packages method and appara

1994-08-30

1996-10-15

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257713, 257796, 361715, 361718, 361722, H05K 720

Patent

active

055660517

ABSTRACT:
An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.

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IBM Technical Disclosure Bulletin, vol. 22, No. 6, pp. 2336-2337 (Flexible Semiconductor Credit Card) Nov. 1979.

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