Ultra high density integrated circuit packages method

Details Ultra high density integrated circuit packages method Ultra high density integrated circuit packages method

1993-05-11

1994-01-18

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 264102, 437205, 437209, H01R 4300

Patent

active

052790290

ABSTRACT:
An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.

REFERENCES:
patent: 3713893 (1973-01-01), Shirland
patent: 4241493 (1980-12-01), Andrulitis et al.
patent: 4321418 (1982-03-01), Dran et al.
patent: 4733461 (1988-03-01), Nakano
Information allegedly written by Emory Garth regarding "Memory Stacks," Applicant received a fasimile from Emory Garth on Jan. 26, 1993, Applicant does not know when this information was written or its validity.
Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM MODULE and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM MODULE, pp. 865-870.

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