Ultra high density integrated circuit packages method

Details Ultra high density integrated circuit packages method Ultra high density integrated circuit packages method

1993-04-05

1994-11-29

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29846, 235488, 235492, 437211, 437219, H05K 1300

Patent

active

053677668

ABSTRACT:
Thin and durable level-one and level-two integrated circuit packages are provided. A thin and durable level-one package is achieved in one method involving a molding technique of evenly applying molding compound to an integrated circuit die element. The casing surrounding a die element may be reduced or eliminated in part to thin the level-one package provided any necessary steps are taken to ensure the integrity of the package. Moisture-barriers, as an example, may be provided to the upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may also be constructed with one or more metal layers to prevent warpage. These level-one packages may be aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors may be thermally coupled to the level-two package to help dissipate heat.

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