Ultra high density integrated circuit packages

Details Ultra high density integrated circuit packages Ultra high density integrated circuit packages

1993-10-08

1995-08-29

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 165 803, 165185, 257713, 257719, 361735, 361744, H05K 720

Patent

active

054466202

ABSTRACT:
Thin and durable level-one and level-two integrated circuit packages are provided. Moisture-barriers may be provided to upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may be constructed with one or more metal layers to prevent warpage. These level-one packages are aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors are thermally coupled to the level-two package to help dissipate heat.

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