Ultra flat polishing

Details Ultra flat polishing Ultra flat polishing

1994-12-12

1998-03-31

Smith, James G.

Abrading

Machine

Rotary tool

451288, 451285, 451388, B24B 500

Patent

active

057331820

ABSTRACT:
A polishing apparatus comprises a pressure container having a first opening at its bottom and being rotatable about an axis perpendicular to a plane of the first opening; a wafer support coupled elastically to the first opening, sealing the first opening hermetically and having a wafer supporting surface; and a lower surface plate disposed underneath the wafer supporting surface and having a polishing surface approximately parallel to the wafer supporting surface. The wafer support may be provided with flatness adjusting means for selectively applying a larger pressure on a region of the wafer held on the wafer supporting surface than a pressure on other region. The flatness adjusting means may comprise a plurality of pressing pins, or may comprise a hollow within the wafer support, a surface plate having elasticity and sealing the hollow, and means for applying pressure to the hollow. Wafer can be polished under uniform pressure applied on the back surface. Flatness of the wafer can be improved.

REFERENCES:
patent: 4213698 (1980-07-01), Firtion et al.
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4918869 (1990-04-01), Kitta
patent: 5036630 (1991-08-01), Kaanta et al.
patent: 5377451 (1995-01-01), Leoni et al.
patent: 5423558 (1995-06-01), Koeth et al.
patent: 5441444 (1995-08-01), Nakajima

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