Ultra fine probe contacts

Details Ultra fine probe contacts Ultra fine probe contacts

1997-05-27

1999-07-20

Brown, Glenn W.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324757, 324765, G01R 3102, G01R 3126

Patent

active

059260297

ABSTRACT:
This discloses a probe structure which does not rely on cantilevered wire and which has improved and controlled contact pressure between the probe tip contacts and the I/O pads on a semiconductor chip and which comprises a plurality of conductive contact electrodes, electrically coupled to respective leads, formed on a film stretched across a respective plurality of through holes established in a substrate. The through holes and the contact electrodes are aligned with one another and both positionally match selected I/O pads existing on a semiconductor chip to be probed. Also disclosed is a probe utilizing means connected to each one of the holes to control the pressure in the holes and between the probes and any contact on a device in contact with the probe.

REFERENCES:
patent: 4912399 (1990-03-01), Greub et al.
patent: 4922192 (1990-05-01), Gross et al.
patent: 5020219 (1991-06-01), Leedy
patent: 5180977 (1993-01-01), Huff
patent: 5239260 (1993-08-01), Widder et al.
patent: 5422574 (1995-06-01), Kister
patent: 5428298 (1995-06-01), Ko
patent: 5625298 (1997-04-01), Hirano et al.

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