Ultimate inductive head integrated lapping system

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29603, B24B 4910

Patent

active

053615476

ABSTRACT:
A lapping control system for accurately obtaining a desired throat height of each of a plurality of batch fabricated thin film magnetic transducers, comprises a row of thin film transducers formed on a substrate, the row comprising a height defining edge and at least four spaced sensing devices, a first two of the sensing devices comprising switch devices each offset a predetermined amount from the height defining edge, and a second two of the sensing devices comprising resistive devices each offset a predetermined amount from the height defining edge, a support of mounting the row of thin film magnetic transducers in a position to lap the height defining edge of each of the thin film magnetic transducers and the sensing devices, a measuring device for measuring the resistance of the resistive devices during lapping of the height defining edge, apparatus responsive to the measured resistance and To a selected sate of at least one of the two switch devices for calibrating resistance versus throat height characteristics for each of the thin film magnetic transducers in the row, and for terminating the lapping process when a predetermined throat height is reached for each of the thin film magnetic transducers.

REFERENCES:
patent: 3821815 (1974-06-01), Abbott et al.
patent: 4014141 (1977-03-01), Riddle et al.
patent: 4219853 (1980-08-01), Albert et al.
patent: 4295173 (1981-10-01), Romankiw et al.
patent: 4511942 (1985-04-01), Valstyn
patent: 4689877 (1987-09-01), Church
patent: 4841625 (1989-06-01), Valstyn
patent: 4861398 (1989-08-01), Fukuoka et al.
patent: 4912883 (1990-04-01), Chang et al.
patent: 4914868 (1990-04-01), Church et al.
patent: 4991046 (1991-02-01), Adamson et al.
patent: 5175938 (1993-01-01), Smith
patent: 5214589 (1993-05-01), Tang
Kawakami et al., J. Appl. Phys., vol. 61, No. 8, p. 4163-6 (Apr. 1987).
IEEE Transacations on Magnetics, vol. Mag-17, No. 6, Nov. 1981, Substrate Testing of Film Heads by N. C. Anderson and R. E. Jones, Jr.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Ultimate inductive head integrated lapping system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Ultimate inductive head integrated lapping system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultimate inductive head integrated lapping system will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1773136

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.