U-seam

Details U-seam U-seam

2005-02-15

2005-02-15

Chang, Yean-Hsi (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S724000, C361S727000

Reexamination Certificate

active

06856512

ABSTRACT:
The present invention provides a U-seam for coupling a panel to an electronics bay. The U-seam includes a top element, a side element, and a base element coupled to the top element through the side element, wherein the top element and the base element are spaced apart to form a gap therebetween, and wherein the gap is adapted to receive a portion of a first panel and to reduce the amount of electromagnetic interference passing between the portion of the first panel and the top, the side, and the base elements.

REFERENCES:
patent: 5398833 (1995-03-01), Klauss et al.
patent: 6550877 (2003-04-01), Anderson et al.
patent: 0129883 (1984-06-01), None
patent: 129883 (1985-01-01), None
patent: 419949 (1991-04-01), None
patent: 2223359 (1990-04-01), None
patent: 2285388 (1995-07-01), None
patent: 9920092 (1999-04-01), None
“Thin Electronics Bay Specification, A Server System Infrastructure (SSI) Specification for Thin Servers, Version 1.0”, Intel Corporation, et al, 2001, 2002.
“Thin Electronics Bay Specification, A Server System Infrastructure (SSI) Specification for Thin Servers, Version 1.1”, Intel Corporation, et al, 2002.

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