Type of loop heat conducting device

Details Type of loop heat conducting device Type of loop heat conducting device

2006-05-02

2009-06-09

Duong, Tho v (Department: 3744)

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

C165S104260

Reexamination Certificate

active

07543629

ABSTRACT:
This invention relates to a type of loop heat conducting device, comprising an evaporator and a condenser which are connected together by means of a loop pipe, in order to form a cyclic loop for a liquid working medium, wherein the evaporator has a wick network core, and multiple tunnels are formed on the wick network core, and one end of the tunnels converges at a vapor chamber and is connected to a loop pipe to form a gaseous working medium outlet, and the terminal end of the pipe extends into and comes into contact with the internal part of the wick network core, and a compensation chamber for liquid working medium is formed on the upper section of the wick network core. Consequently, the cyclic loop that separates the gas and liquid enables the optimal heat dissipation capacity, and also has a structure that is simplified, thereby allowing for easy mass production.

REFERENCES:
patent: 5725049 (1998-03-01), Swanson et al.
patent: 6330907 (2001-12-01), Ogushi et al.
patent: 6450132 (2002-09-01), Yao et al.
patent: 2003/0042009 (2003-03-01), Phillips
patent: 2003/0178184 (2003-09-01), Kroliczek et al.
patent: 2004/0206480 (2004-10-01), Maydanik et al.
patent: 2005/0067155 (2005-03-01), Thayer et al.
patent: 2002340489 (2002-11-01), None
patent: 9421100 (2005-12-01), None

Affiliated with

Also associated with

Rating

Type of loop heat conducting device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Type of loop heat conducting device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Type of loop heat conducting device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4126135