Two-step preplate system for polymeric surfaces

Details Two-step preplate system for polymeric surfaces Two-step preplate system for polymeric surfaces

1978-11-28

1980-11-18

Smith, John D.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427304, 427306, 427343, 427404, 4274192, 4274431, B05D 304, C23C 302

Patent

active

042346282

ABSTRACT:
Non-metallic surfaces are prepared to receive an electroless metal deposit of copper, gold or nickel using a two-step adsorption procedure to sensitize the surface. The surface is first immersed in a bath containing copper in solution or suspension to adsorb the copper on the surface, followed by contact with a nickel or cobalt bath at a pH above 4 to encourage adsorption of the second metal. The adsorbed metals are then reduced with a borohydride reducing agent, with the nickel or cobalt serving to catalyze the reduction of the copper. The surface can be rinsed between the two adsorption steps without decreasing the effectiveness of the treatment.

REFERENCES:
patent: 3925578 (1975-12-01), Polichette
patent: 3930963 (1976-01-01), Polichette
patent: 3958048 (1976-05-01), Donovan et al.
patent: 3959547 (1976-05-01), Polichette
patent: 3962494 (1976-06-01), Nuzzi
patent: 3993801 (1976-11-01), Feldstein
patent: 4035227 (1977-07-01), Doty et al.
patent: 4036707 (1977-07-01), Januschkowetz

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