Two-sided bias sputter deposition method and apparatus

Details Two-sided bias sputter deposition method and apparatus Two-sided bias sputter deposition method and apparatus

1978-12-22

1980-01-15

Mack, John H.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

041837975

ABSTRACT:
Method and apparatus for coating a thin film upon a substrate in a vacuum chamber using the sputter deposition technique on both sides of the substrate without rotation of the substrate. The substrate is held between two movable rams and is located between two targets equal to or larger in size than the substrate. The rams supply power and cooling to the substrate. A glow suppression ring circumscribes the periphery of the substrate. The cathodes of the sputtering system can be magnetically enhanced for concentration of the sputtering plasma.

REFERENCES:
patent: 3627663 (1971-12-01), Davidse
patent: 3741886 (1973-06-01), Urbanek et al.
patent: 3878085 (1975-04-01), Corbani
patent: 3979273 (1976-09-01), Panzera et al.
patent: 4013532 (1977-03-01), Cormia et al.
patent: 4073262 (1978-02-01), Scheffel et al.
D. R. Rogalla, Coating Magnetic Storage Disks; IBM Technical Disclosure Bulletin, vol. 11, No. 11, Apr. 1969, p. 1611.

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