Two-shot molded article for use in circuit formation

Details Two-shot molded article for use in circuit formation Two-shot molded article for use in circuit formation

1990-10-16

1992-03-24

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 428323, 428480, 361397, B32B 900

Patent

active

050987690

ABSTRACT:
An integrally molded article for use in circuit formation is provided by use of a two-shot injection molding procedure. A previously molded primary thermoplastic resin composition is pretreated for plating and a specifically defined secondary thermoplastic resin composition having a melt viscosity of 200 P. or below is injection molded about preselected portions of the primary molding which are not intended to bear a circuit. Such secondary thermoplastic resin composition comprises an anisotropic melt-forming polyester having a weight average molecular weight of 10,000 or below and a particulate inorganic filler. Excellent adhesion between the primary and secondary thermoplastic resins is achieved.

REFERENCES:
patent: 4626371 (1986-12-01), Ikenaga et al.
patent: 4632798 (1986-12-01), Eickman et al.
patent: 4719250 (1988-01-01), Eickman et al.
patent: 4720424 (1988-01-01), Eickman et al.
patent: 4908259 (1990-03-01), Yumoto

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