Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-12-24
2011-12-20
Bui, Hung S (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S803000, C361S755000
Reexamination Certificate
active
08081489
ABSTRACT:
Electronic assemblies are described. One embodiment includes a circuit board, a socket coupled to the circuit board, and a device positioned in the socket. The embodiment also includes a load mechanism including first and second components, the first component pivotally coupled to the circuit board, the first component including first and second lever arms and an axle region therebetween, the first component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the first component lever arms. The load mechanism also includes a second component pivotally coupled to the circuit board, the second component including first and second lever arms and an axle region therebetween, the second wire component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the second wire component lever arms. The first and second wire components are positioned so that when a force is applied to the first component lever arms, the first lever arm of the first component engages the first lever arm of the second component and applies a force thereto, and the second lever arm of the first component engages the second lever arm of the second component and applies a force thereto. Other embodiments are described and claimed.
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Beall Christopher S.
Llapitan David J.
Bui Hung S
Intel Corporation
Konrad Raynes & Victor LLP
Raynes Alan S.
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