Two-phase cooling apparatus for electronic equipment and the lik

Details Two-phase cooling apparatus for electronic equipment and the lik Two-phase cooling apparatus for electronic equipment and the lik

1989-04-24

1989-11-14

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

165 41, 16510433, 361385, F28D 1502

Patent

active

048800538

ABSTRACT:
A two-phase cooling device includes a sealed enclosure defined by at least first and second, spaced thermally conductive walls interconnected by side walls. One of the thermally conductive walls is adapted for interconnection in a thermally conductive relationship with the item desired to be cooled. A wick structure is disposed within the generally hollow interior of the sealed enclosure, and includes a first wick portion extending along at least a portion of the thermally conductive wall adjacent the item to be cooled and at least one second wick portion protruding transversely from the first wick portion. The second wick portion is at least partially submerged within a thermally conductive liquid disposed within the hollow interior of the sealed enclosure. The thermally conductive liquid is capable of being transported through the wick portions, with the liquid being evaporated by the transfer of heat from the item to be cooled into the first wick portion. The vapor is then condensed on various surfaces such as those defined by internal components, as well as the surface of the thermally conductive liquid.

REFERENCES:
patent: 3489207 (1970-01-01), Miller
patent: 3750745 (1973-08-01), Moore, Jr.
patent: 3852805 (1974-12-01), Brzozowski
patent: 4377198 (1983-03-01), Welling et al.
Connors et al., P.M., Flat-Type Heat Pipes, IBM Technical Disclosure Bulletin, vol. 18, No. 3, pp. 675-676, 8/1975.

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