Two-part, room temperature curable epoxy resin/...

Details Two-part, room temperature curable epoxy resin/... Two-part, room temperature curable epoxy resin/...

2005-06-28

2005-06-28

Maki, Steven D. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S330000, C525S530000

Reexamination Certificate

active

06911109

ABSTRACT:
The present invention provides two part, room-temperature curable epoxy resin/(meth)acrylate compositions. The compositions provide among other advantageous properties high flash point and low odor, and reaction products thereof demonstrate at least comparable and often improved fixture time, improved adhesion strength, and improved adhesion strength over time, to substrates which are ordinarily difficult to bond (such as plastics) with epoxy-based compositions, as contrasted to commercially available comparable products that are of low flash point and higher odor.

REFERENCES:
patent: 2633458 (1953-03-01), Shokal
patent: 2768153 (1956-10-01), Shokal
patent: 2824851 (1958-02-01), Hall
patent: 2847395 (1958-08-01), Wear
patent: 2890202 (1959-06-01), Parker
patent: 2992193 (1961-07-01), Porret et al.
patent: 3066112 (1962-11-01), Bowen
patent: 3156580 (1964-11-01), Howard
patent: 3300547 (1967-01-01), Gorman et al.
patent: 3316040 (1967-04-01), Tobak
patent: 3337406 (1967-08-01), Newey et al.
patent: 3591438 (1971-07-01), Toback et al.
patent: 3684617 (1972-08-01), Windecker
patent: 3725504 (1973-04-01), Owston
patent: 3832274 (1974-08-01), Owston
patent: 3870675 (1975-03-01), Kusayama et al.
patent: 3873640 (1975-03-01), Owston et al.
patent: 3890407 (1975-06-01), Briggs, Jr. et al.
patent: 3912773 (1975-10-01), Havriliak
patent: 3940537 (1976-02-01), Burns
patent: 3994764 (1976-11-01), Wolinski
patent: 3997694 (1976-12-01), Wu
patent: 4051195 (1977-09-01), McWhorter
patent: 4053680 (1977-10-01), Wasserman et al.
patent: 4055541 (1977-10-01), Riew
patent: 4092443 (1978-05-01), Green
patent: 4126504 (1978-11-01), Wolinski et al.
patent: 4168338 (1979-09-01), Kato et al.
patent: 4182644 (1980-01-01), Briggs, Jr. et al.
patent: 4218279 (1980-08-01), Green
patent: 4219377 (1980-08-01), Albrecht
patent: 4220513 (1980-09-01), Green et al.
patent: 4228062 (1980-10-01), Lee, Jr. et al.
patent: 4235986 (1980-11-01), Catena
patent: 4237242 (1980-12-01), Frankel
patent: 4243706 (1981-01-01), Williams
patent: 4251565 (1981-02-01), Bowen
patent: 4252592 (1981-02-01), Green
patent: 4252593 (1981-02-01), Green
patent: 4276352 (1981-06-01), Green
patent: 4282353 (1981-08-01), Green
patent: 4308367 (1981-12-01), Green et al.
patent: 4339567 (1982-07-01), Green et al.
patent: 4368253 (1983-01-01), Green et al.
patent: 4383025 (1983-05-01), Green et al.
patent: 4391958 (1983-07-01), Minato et al.
patent: 4398014 (1983-08-01), Green et al.
patent: 4413052 (1983-11-01), Green et al.
patent: 4416975 (1983-11-01), Green et al.
patent: 4426243 (1984-01-01), Briggs
patent: 4536546 (1985-08-01), Briggs
patent: 4552604 (1985-11-01), Green
patent: 4668736 (1987-05-01), Robins et al.
patent: 4714730 (1987-12-01), Briggs et al.
patent: 4755571 (1988-07-01), Irving et al.
patent: 4773957 (1988-09-01), Briggs
patent: 4892764 (1990-01-01), Drain et al.
patent: 5137990 (1992-08-01), Corley
patent: 5643994 (1997-07-01), Kish et al.
patent: 5945461 (1999-08-01), Gosiewski et al.
patent: 6248204 (2001-06-01), Schuft
patent: 2179955 (1987-03-01), None
patent: 2166447 (1987-05-01), None
patent: WO 95/181183 (1995-07-01), None
patent: WO 00/02204 (2000-01-01), None
patent: WO 00/40663 (2000-07-01), None

Affiliated with

Also associated with

Rating

Two-part, room temperature curable epoxy resin/... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Two-part, room temperature curable epoxy resin/..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Two-part, room temperature curable epoxy resin/... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3510201